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Paste Printing Machine×谷電機工業 - List of Manufacturers, Suppliers, Companies and Products

Paste Printing Machine Product List

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Solder Paste Printer [Achieving Various Printing Forms!]

Solder Paste Printer [Achieving Various Printing Forms!]

A solder paste printer that realizes a variety of printing forms made possible by the press-in method!

This is a printing machine that solely pursues stable high-quality printing. It is equipped with a uniquely developed press-in squeegee unit, capable of meeting various printing needs from high-density patterns to large-diameter thick film printing. (Main Features) ● The cartridge, which is shielded from outside air, stores solder paste, preventing deterioration such as oxidation. ● The rotation pressure of the roller shaft inside the cartridge reliably fills the solder paste into the mask opening. ● The automatic solder paste replenishment function maintains a constant amount of solder paste within the cartridge. ● The automatic stirring mechanism keeps the viscosity of the solder paste inside the cartridge consistent. ● After squeegeeing, the machine automatically recovers the solder paste each time, leaving no solder paste on the mask. ● By combining contact printing and off-contact printing, the "hybrid squeegeeing" accommodates a variety of printing forms. *For more details, please request materials or view the PDF data available for download.

  • Other mounting machines
  • Other semiconductor manufacturing equipment
  • Printing Machinery

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Until the via filling of conductive paste! Solder paste printer TD-4420

Until the via filling of conductive paste! Solder paste printer TD-4420

High precision design with a printing accuracy of ±10μm supports narrow and narrow-pitch printing! By realizing 'hybrid squeegeeing,' we challenge the limits of screen printing.

The product "Solder Paste Printer TD-4420" is a printing machine that uses a paste injection method and is equipped with a housing-type squeegee unit. (Examples of Use) - Formation of solder bumps on flip chip interposer substrates (bump pitch 150–200μm) - Formation of solder bumps on 6/8 inch wafers for printed devices (bump pitch 120–150μm) - Formation of solder bumps on 4 inch wafers for wireless communication devices (bump pitch 150–170μm) (Features of the Squeegee Unit) - The paste is stored in a cartridge with a structure that is shielded from outside air, which helps prevent deterioration such as oxidation. - The rotation pressure of the roller shaft inside the cartridge ensures that the paste is reliably filled into the mask opening. - The automatic replenishment and automatic stirring functions maintain a constant amount and viscosity of the paste within the cartridge. - The printing method does not leave paste on the mask after squeegeeing, which can reduce paste loss. *For more details, please refer to the PDF document. Evaluation demonstrations in a clean room (Class 10,000) are also possible. Please feel free to contact us.

  • Soldering Equipment

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